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LOGO118_80mm
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Plasma Enhanced Atomic Layer Deposition (PEALD)

  • Process development & contract coating: Metal oxides & nitrides, (poly)crystalline/amorph, conductive/nonconductive, including: Al2O3, SiO2, TiO2, TiN and stacks thereof
  • Tool manufacturer:
    semi or full automated PEALD & ALE batch tool
    also applicable for PEALD-ALE in-situ processing (in one chamber!)
    for 150mm (4 at once), 200mm (2 at once), 300mm, 430mm wafer substrates
  • FALP ® (Fast Atomic Layer Processing): optimized self developed technology for fast gas switching (down to 10ms) and cycle times of only a few secondes (usually under 3.5s) combined with a 10ms resoluting realtime process monitoring
  • Consulting:
    Consulting for your plasma processes
    Process analysis and optimization (OES, IR absorption, chamber design)
  • Technology development:
    Tailor made components for your ALD, ALE and plasma applications

 

Deliverables

Specifications and Deliverables
Consulting
Project Management
Process and Technology Development
Complete PEALD & ALE Tool
Value Proposition
Time safing & higher productivity (fast processes with FALP-technology and no switching between chambers for ALD/ALE combined processes)
Safe one Chamber by means of ALD-ALE in-situ processing

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Author Info

Marco Radehaus

Member since 4 weeks ago
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