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Thin glass handling and functionalization for panel-level applications

Listing Description

Glass provides a promising basis for technological innovations in microelectronics. It can serve as a core and interposer substrate for advanced packaging, enabling panel-level processing in semiconductor electronics. Fraunhofer FEP brings over 10 years of expertise in ultra-thin glass handling, functionalization, and processing, with extensive reliability testing capabilities. This know-how can be applied to glass-based substrates for advanced packaging.

Offer Details

Specifications and Deliverables:

• Glass handling up to 1200 mm x 600 mm panel size
• High surface cleanliness and advanced functionalization capabilities
• Compatibility with semiconductor and packaging processes
• Deposition and functionalization process recipes
• Process data and reliability testing results
• Sample glass substrates for evaluation
• Integration guidelines for industrial implementation

Value Proposition:

• Feasibility studies and pilot-scale sample production for rapid validation
• Development of functional thin films and complex layer stacks on glass
• Expertise in ultra-thin glass handling and processing for high reliability
• End-to-end support including concept development, technology transfer, and process integration
• Access to pilot-line infrastructure and advanced reliability testing capabilities

Input Required from Customer:

• Specific application requirements (e.g., packaging type, photonic integration needs)
• Material and substrate specifications
• Target performance and reliability criteria
• Design layouts or process constraints
• Volume expectations (prototype, pilot, or scale-up)
• Any existing process parameters or integration conditions

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Adress:

Winterbergstraße 28
Dresden
Saxony
01277
Germany

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