Description

This Research and Innovation Action (RIA) aims to strengthen Europe's technological sovereignty in 6G radio frequency (RF) Front End Modules (FEMs) by developing the next generation of highly integrated, energy-efficient and high-performance semiconductor technologies for future wireless communication systems. The topic supports research into advanced front-end architectures, semiconductor technologies and integration approaches that enable future 6G infrastructure while reinforcing Europe's strategic position in wireless communications and semiconductor manufacturing.

Funding Amount

Maximum EU budget for the topic

• EUR 12 million

Expected EU contribution per project

• Approximately EUR 12 million, although proposals requesting different amounts may be submitted where appropriately justified. One project is expected to be funded.

Submission Deadlines

• Call launch: 7 July 2026
• Submission deadline (Full Project Proposal): 16 September 2026, 17:00 Brussels time

This is a one-stage call.

Eligible Types of Businesses

The call is open to organisations eligible under the Chips Joint Undertaking and Horizon Europe rules, including:

• SMEs
• Large enterprises
• Semiconductor manufacturers
• RF and wireless communication companies
• Telecommunications equipment manufacturers
• Universities
• Research institutes
• Research and Technology Organisations (RTOs)
• Design houses and integrated circuit developers
• Packaging and integration technology providers
• Other eligible legal entities

Projects are expected to bring together expertise across semiconductor technologies, RF engineering, wireless communications, integrated circuit design, packaging and system integration.

Eligible Countries

Participation is limited to legal entities established in:

• EU Member States;
• EEA countries (Iceland, Liechtenstein and Norway);
• Horizon Europe Associated Countries;
• OECD countries;
• Mercosur countries;
• countries that have signed a Digital Partnership or Trade and Technology Council agreement with the European Union.

Participation is subject to the Chips JU security provisions. Entities controlled by non-eligible countries may be subject to additional restrictions or exclusion where they cannot provide the required security guarantees.

Submission Conditions

• Research and Innovation Action (RIA).
• One-stage submission process.
• Co-funded with National Funding Authorities (NFA).
• Projects should focus on collaborative research addressing key technological challenges in 6G RF Front End Modules.
• Proposals should demonstrate a clear pathway from research towards future industrial exploitation and European technological leadership.
• Standard Chips JU and Horizon Europe admissibility, eligibility and evaluation rules apply.
• Maximum EU contribution to a single partner is limited to 30% of the total EU funding.

Target TRL

The topic targets early-stage research and technology development. Projects are expected to start from approximately TRL 3–4 and advance towards validated technology concepts during the project.