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International collaboration EU and Japan on semiconductors

Description

This Simple Grant (SG) supports joint EU–Japan collaborative research and innovation projects addressing key challenges in advanced semiconductor technologies. The call focuses on strengthening strategic cooperation between European and Japanese organisations to accelerate innovation in heterogeneous integration, chiplets, advanced packaging and integrated photonics, particularly for AI-enabled semiconductor systems.

Projects are expected to involve close collaboration with Japanese partners and contribute to strengthening Europe's semiconductor ecosystem while fostering global standards and industrial competitiveness.

Funding Amount

Total indicative EU budget

  • EUR 5 million

Expected EU contribution per project

  • Between EUR 3 million and EUR 5 million, although proposals requesting different amounts are permitted.

Funding mode

  • Simple Grant (SG)
  • Co-funded with the National Funding Authority (NFA).

Submission Deadlines

  • Call launch: 7 July 2026
  • Submission deadline: 24 September 2026, 17:00 Brussels time
  • Submission process: One-stage (Full Proposal).

Submission Conditions

  • Type of Action: Simple Grant (SG)
  • One-stage Full Proposal submission.
  • Co-funded by National Funding Authorities.
  • Standard Digital Europe Programme admissibility, eligibility and evaluation rules apply.
  • Proposal page limits:
    • Relevance: 20 pages
    • Implementation: 40 pages
    • Impact: 20 pages.
  • Standard Chips JU evaluation procedures apply.

Eligible Types of Businesses / Organisations

The call is open to organisations eligible under the Digital Europe Programme and Chips JU rules, including:

  • Semiconductor manufacturers
  • Semiconductor equipment suppliers
  • Material suppliers
  • Universities
  • Research organisations
  • Research and Technology Organisations (RTOs)
  • SMEs
  • Large enterprises
  • AI technology companies
  • Integrated photonics organisations
  • Industry associations
  • Other organisations active in semiconductor R&D and innovation.

Projects are expected to build partnerships across industry, academia and research organisations, with mandatory collaboration involving Japanese partners.

Eligible Countries

Participation follows the standard Digital Europe Programme and Chips JU eligibility rules.

Eligible participants include organisations established in:

  • EU Member States
  • EEA countries (Iceland, Liechtenstein and Norway)

Japanese organisations participate as the international partners within the framework of this joint EU–Japan initiative, supported through corresponding Japanese funding mechanisms. Entities controlled from third countries remain subject to the standard security provisions under the Digital Europe Programme.

Target TRL

Technology Readiness Level (TRL): 5–7

The centre of gravity of the proposed work should target demonstration and validation in laboratory and pilot manufacturing environments.

Expected Outcome

Projects are expected to deliver:

  • Advanced heterogeneous integration technologies, particularly:
    • 2.5D packaging
    • 3D packaging
    • Integrated photonics supporting AI functionality.
  • Standardised chiplet interfaces enabling interoperability.
  • A stronger and more dynamic international chiplet ecosystem.
  • Demonstration of solutions in laboratory and pilot environments.
  • Validation in semiconductor manufacturing use cases.
  • Direct and immediate impact on European semiconductor industry.
  • Active knowledge transfer through:
    • Industry workshops
    • Scientific publications
    • Networking events.

Scope

Projects should focus on collaborative research and innovation in advanced semiconductor technologies, including (but not limited to):

  • Development of 2.5D and 3D heterogeneous integration technologies.
  • Development of integrated photonics processes for semiconductor systems.
  • Chiplet co-optimization and interface design.
  • Advanced packaging technologies including:
    • Through-Silicon Vias (TSVs)
    • Interposers
    • Advanced bonding techniques.
  • Collaboration between:
    • Material scientists
    • Chemical engineers
    • Semiconductor manufacturers
    • AI experts
    • Research organisations.
  • Bridging research with industrial applications to improve commercial viability.
  • Supporting broad industrial adoption of advanced semiconductor manufacturing technologies.
  • Contributing to international semiconductor standards through EU–Japan cooperation.

Applicants must describe how Japanese organisations are involved in the project and specify the collaborative activities carried out jointly with their Japanese counterparts. The programme expects a comparable financial commitment from Japanese organisations.

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