Description

This Innovation Action aims to reinforce Europe's leadership and resilience in power electronics by accelerating the industrialisation of next-generation power semiconductor technologies and strengthening the entire European value chain. The topic addresses Europe's dependence on non-EU suppliers, increasing global competition, and the need for greater energy efficiency, power density and manufacturing capacity. Projects should help secure European technological sovereignty by advancing innovative power electronic components, devices, packaging and manufacturing technologies that are close to market deployment.

Funding Amount

Maximum EU budget for the topic

• EUR 20 million

Expected EU contribution per project

• Approximately EUR 10 million, although proposals requesting different amounts may also be submitted if appropriately justified.

Submission Deadlines

• Call launch: 7 July 2026
• Submission deadline (Full Project Proposal): 16 September 2026, 17:00 Brussels time

This is a one-stage call.

Eligible Types of Businesses

The call is open to organisations eligible under the Chips Joint Undertaking and Horizon Europe rules, including:

• SMEs
• Large enterprises
• Power semiconductor manufacturers
• Electronics manufacturers
• Universities
• Research institutes
• Research and Technology Organisations (RTOs)
• Equipment manufacturers
• Packaging and integration companies
• System integrators
• Other eligible legal entities

Projects should involve collaboration across the complete European power electronics value chain, from materials and semiconductor technologies through packaging and end-use applications.

Eligible Countries

Participation is limited to legal entities established in:

• EU Member States;
• EEA countries (Iceland, Liechtenstein and Norway);
• Horizon Europe Associated Countries;
• OECD countries;
• Mercosur countries;
• countries that have signed a Digital Partnership or Trade and Technology Council agreement with the European Union.

Entities directly or indirectly controlled by non-eligible countries are subject to additional security conditions and may be excluded unless appropriate guarantees are provided.

Submission Conditions

• Innovation Action (IA).
• One-stage submission process.
• Co-funded with National Funding Authorities (NFA).
• Projects should build on existing European initiatives and consider collaboration with the Wide Band Gap (WBG) Pilot Line.
• Synergies with other Chips Act pilot lines and Competence Centres are encouraged.
• Proposals should contribute to trustworthy electronics, resilient supply chains and European technological sovereignty.
• Standard Chips JU/Horizon Europe admissibility, eligibility and evaluation rules apply.

Target TRL

The topic explicitly promotes high-TRL industrial innovation with an accelerated development approach.

Projects are expected to achieve TRL 6–7 for different project actions throughout the project lifetime:

• some actions reaching TRL 6–7 during the first year;
• additional actions reaching TRL 6–7 during the second year;
• remaining actions reaching TRL 6–7 by the end of the third year.

The call is designed to accelerate industrialisation and market entry through iterative development cycles.