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AlScN Piezoelectric Thin Films for MEMS and Sensor Applications: Energy Harvesting, Ultrasound Microscopy and Integrated Sensing

Listing Description

This technology provides high-quality AlN and AlScN piezoelectric thin films produced via magnetron sputtering, with optimized scandium content to maximize piezoelectric performance (d33) and ensure uniformity over large areas. The films are specifically tailored for MEMS devices, including energy harvesting systems, ultrasound imaging, and micro-sensors. The offering ensures CMOS compatibility, scalable deposition processes, and comprehensive film characterization, making it suitable for advanced sensing and actuation applications.

Offer Details

Specifications and Deliverables:

• Optimized AlScN composition with high Sc content for strong piezoelectric response
• High c-axis orientation for enhanced film performance
• Film thickness ranging from 100 nm to several tens of micrometers
• Surface roughness below 1–2 nm RMS at 2 µm scale
• Deposition rates up to 3 nm/s with stress management
• Wafer-scale uniformity and compatibility with multiple substrates (Si, glass, ceramics, steel)
• Custom adaptation of film and layer stack properties
• Film deposition services and feasibility studies
• Deposition recipes and wafer-scale process data
• Advanced analytics (XRD, AFM, PFM, SEM, ellipsometry)
• Test reports, sample depositions, and electromechanical simulations

Value Proposition:

• CMOS-compatible piezoelectric AlScN films for seamless MEMS integration
• High-sensitivity performance for sensing, acoustic, and energy harvesting applications
• Scalable, high-rate reactive magnetron sputtering for industrial production
• Optimized material properties for robust performance and process tolerance
• Versatile applicability across MEMS, sensors, and actuator technologies

Input Required from Customer:

• Target application (e.g., MEMS sensor, energy harvester, ultrasound device)
• Required piezoelectric properties and film thickness
• Substrate type and compatibility requirements
• Device design specifications and integration constraints
• CMOS compatibility and process requirements
• Production scale (prototype, pilot, or mass production)

Fields of Application:

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Adress:

Winterbergstraße 28
Dresden
Saxony
01277
Germany

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