D Paste 170 EI has been developed to be overprinted on low-voltage circuits, serving as a protective layer in multilayer systems or under PSAdhesives. After curing, it forms a robust film with excellent adhesion and good elasticity, offering reliable protection against moisture and environmental stress. This makes it compatible with a wide range of substrates used in printed electronics.
Formulation D Paste 170 EI is based on a carefully selected blend of acrylates with high tensile elongation, cured using benzophenone-free photoinitiators. To maintain optimal performance, avoid exposing the wet paste to temperatures exceeding 40°C for extended periods and direct sunlight. Before deposition, allow formulation D Paste 170 EI to stabilize at screen-printing room temperature for at least 12 hours.
The formulation is benzophenone-free and fully compatible with common conductive silver inks in printed electronics workflows.
