Go Back
Description
Offer Details
Photos
Location and Map
Contact
Related
Add to favorites:
Share:
Deposition of Active and Passive Films for Photonic Integrated Platforms (PIC) and Panel-Level Packaging

Listing Description

This technology provides deposition of both passive and active thin films for photonic integrated platforms and panel-level packaging. Passive materials such as Si3N4 are used for waveguide structures, while active materials including AlScN, BTO, BFO, and LiNbO3 (LN) offer high electro-optic performance. The solution delivers low-loss films, partially CMOS-compatible processes, and scalable manufacturing. It also includes design optimization, as well as thermal and stress management for reliable photonic integration.

Offer Details

Specifications and Deliverables:

• Wafer sizes up to 300 mm diameter and panel sizes up to 600 mm x 600 mm
• Thermal management tailored to specified power requirements
• Compatibility with CMOS processing environments
• Deposition of passive (e.g., Si3N4) and active electro-optic materials (AlScN, BTO, BFO, LN)
• Material development and customization
• Thin film deposition and process optimization
• Optical characterization and performance evaluation
• Process recipes for integration into manufacturing
• Support for large-area and panel-level fabrication

Value Proposition:

• Deposition of both passive and active films for complete photonic integration solutions
• High-performance electro-optic materials enabling advanced PIC functionality
• Low-loss films for efficient optical signal transmission
• CMOS-compatible and scalable processes for industrial manufacturing
• Integrated support including design optimization, thermal, and stress management

Input Required from Customer:

• Target application (e.g., PIC, LiDAR, telecom, sensing)
• Required optical and electro-optic material properties
• Substrate type, wafer or panel size specifications
• Design and integration requirements for photonic systems
• Thermal and power constraints
• Production scale and manufacturing requirements

Fields of Application:

Patent/Publication Number

Main Patent Claims:

Patent Family:

Photos

Video

Documents

No documents available.

Location and Map

Adress:

Winterbergstraße 28
Dresden
Saxony
01277
Germany

Get Directions

Contact the listings owner

Connect with the Listing Owner!

💬 Please log in now to send a direct message to the listing owner. Not a member yet? Sign up for free and start connecting today!

Related Offers

Unlock Related Offers!

🚀 Gain access to related technology solutions that match your specific needs and interests—carefully selected to support your innovation goals. These offers are exclusively available to our professional members, helping you identify relevant technologies faster and start the right conversations with potential partners.

Upgrade to Professional now and never miss an important opportunity again! Already a member? Log in here to explore your matches.

Related Knowledgeable Resources

Discover More with Professional: Related Knowledge Resources

🔒 You’re missing out on expert-curated knowledge specifically matched to this topic. As a professional member, you gain exclusive access to in-depth articles, guides, and insights that help you make smarter decisions, faster.

Whether you’re preparing a funding proposal, researching a new market, or just need reliable information—our professional knowledge matches save you hours of research and point you directly to what matters.

Upgrade to Professional now  and instantly unlock relevant knowledge tailored to your needs! Already a member? Log in here to view your personalized content.

Viewers

See Who’s Interested in Your Offers!

🎯 Curious about who’s viewing your listings? Unlock insights into your last 20 visitors and discover potential leads instantly! This exclusive feature is only available to our professional members—helping you track engagement, connect with the right audience, and maximize your opportunities.

Upgrade to Professional now to gain access! Already a member? Log in here.