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Energy Harvesting with Piezoelectric Materials

Listing Description

This technology focuses on energy harvesting solutions using high-quality AlN and AlScN piezoelectric thin films deposited via magnetron sputtering. The films are engineered with optimized scandium content to enhance piezoelectric performance and can be tailored for different application scenarios. The process ensures CMOS compatibility, scalable deposition, and comprehensive film characterization, making it suitable for MEMS-based energy harvesting and sensor applications.

Offer Details

Specifications and Deliverables:

• Optimized AlN and AlScN compositions for enhanced piezoelectric properties
• Film thickness up to several tens of micrometers
• Deposition rates up to 3 nm/s for efficient processing
• Stress management and wafer-scale uniformity
• Compatibility with multiple substrates (Si, glass, ceramics, steel)
• Custom adaptation of film and layer stack properties
• Film deposition services and feasibility studies
• Deposition recipes and wafer-scale process data
• Advanced analytics (XRD, AFM, PFM, SEM, ellipsometry)
• Test reports, sample depositions, and electromechanical simulations

Value Proposition:

• High-performance piezoelectric AlN and AlScN films for efficient energy harvesting
• Scalable, high-rate reactive magnetron sputtering for industrial applications
• CMOS-compatible processes enabling seamless integration into electronic systems
• Robust material performance with strong process tolerance
• Customizable film properties for diverse application scenarios

Input Required from Customer:

• Target application (e.g., MEMS energy harvester, sensor system)
• Desired piezoelectric performance and film thickness
• Substrate type and integration requirements
• Design specifications and operating conditions
• CMOS compatibility and process constraints
• Production scale (prototype, pilot, or industrial)

Fields of Application:

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Adress:

Winterbergstraße 28
Dresden
Saxony
01277
Germany

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