The inspection system consists of a winding unit with a CCD camera bank for pixel resolution down to 14 μm (100% web inspection) and a modular, moveable optical microscope with a point resolution down to 1 μm.
- Contactless winding of the substrate under clean room class ISO6
- 100% inspection by means of line scan cameras (pixel resolution 14μm)
- Attached moveable optical microscope (point resolution 1μm)
- Rewind mode for defect analysis detected by the line scan cameras
- Automatic statistical analysis of recorded optical images by spot counting
- Integrated confocal microscopy for substrate and device topography analysis
