Machine name: | Printed electronics pilot line |
Machine type: | Sheet-2-Sheet |
Substrate types to be processed: | Polymer films |
Substrate dimension: | 150 x 150 mm |
Technologies available: | ALD encapsulation, Inkjet printing, slot die coating, vacuum evaporation, encapsulation of organic electronic (OE) devices |
Deposition materials available: | Different precursors for the deposition of barrier layers by ALD, charge carrier materials and active materials for solution processing of OE devices (OLEDs, OPV, perovskite solar cells), metals such as Ag, Al, Ca, Ba for thermal evaporated electrodes |
Typical applications: | Printed electronics |
