From the idea to the finished circuit board – fast and precise implementation of two-layer through-hole SMD layouts in-house.
The IFW Dresden manufactures two-layer, through-hole plated printed circuit boards with structure widths up to 100 µm for prototypes and small series. Depending on the requirements, structuring is carried out either using precise milling or conventional wet-chemical methods with direct exposure or film processes. Chemical tin finishes and solder masking are just as possible as full through-hole plating. Our infrastructure covers the entire process – from layout processing to exposure, etching, and drilling to final processing – for fast, flexible, and precise implementation.
Your benefits
- Complete in-house production from design to finished circuit board
- Finest structure widths down to 100 µm reproducible
- Flexible processes (milling or wet-chemical) for different requirements
- High precision for research, development and functional prototypes
- Individual adjustment of layout, finish and masking
Methods
- Direct exposure (LIMATA UV-P50): Resolution ±1 µm (step size), reproducibility ±10 µm, up to 300×400 mm
- Milling (Isel FlatCom M20): Repeatability ±20 µm, material thickness 0.1–10 mm
- Etching (S30 Stripper): Spray development, spray etching, neutralization, rinsing, drying
- Through-hole plating (Bungard Compakta 40 2CU): up to 300×400 mm, galvanic
- Circuit board plotter (ProtoMat H100): Resolution 0.25 µm, repeatability ±1 µm
Fields of application
- Functional prototypes for electronics development
- Test boards for new components and sensors
- Printed circuit boards for small series in research and development
- Manufacturing special circuits for laboratory experiments