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Thermal Management for High-Power Electronics by Thin Film Packaging: Thermally Conductive Insulation Layers and Thick Metal Heat-Spreader Layers

Listing Description

This technology provides advanced thin-film solutions for thermal management in high-power electronics. It includes thermally conductive insulation layers and thick metal heat-spreader layers deposited using sputter-based processes. Designed for efficient heat dissipation in power electronics packaging, the solution supports large-area substrates, inline integration, CMOS compatibility, and scalable manufacturing. It is suitable for applications such as IGBTs, GaN/SiC devices, automotive power modules, and data-center electronics.

Offer Details

Specifications and Deliverables:

• Aluminum oxynitride (AlON) and aluminum nitride (AlN) insulation layers with thickness from 50 nm to 30 µm
• Thick copper (Cu) heat-spreader layers ranging from 1 to 100 µm
• Tailored thermal conductivity based on material stack requirements
• High dielectric strength, controlled surface roughness, and strong adhesion
• Compatibility with various wafers and substrates
• High-rate sputter deposition of insulating films (2–4 nm/s)
• Material development and customization
• Thin film deposition and process optimization
• Characterization using XRD, AFM, and SEM
• Sample parts and integration guidelines

Value Proposition:

• High thermal conductivity combined with reliable electrical insulation
• CMOS-compatible processes for seamless integration into existing manufacturing lines
• Enhanced thermal cycling resilience for improved device reliability
• Scalable, high-rate sputter deposition suitable for industrial production
• Efficient heat dissipation enabling improved cooling performance in power electronics

Input Required from Customer:

• Target application (e.g., power electronics, automotive modules, data centers)
• Thermal performance requirements and cooling targets
• Substrate type and geometry (wafer, large-area, or panel)
• Electrical insulation and dielectric requirements
• Integration constraints and packaging design
• Production scale and reliability expectations

Fields of Application:

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Adress:

Winterbergstraße 28
Dresden
Saxony
01277
Germany

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