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Thin Glass Reliability Assessment for Panel-Level Applications

Listing Description

This technology focuses on reliability assessment of ultra-thin glass for microelectronics and advanced packaging applications. Glass serves as a core and interposer substrate, enabling panel-level processing in semiconductor manufacturing. With over 10 years of expertise, Fraunhofer FEP provides advanced capabilities in thin glass handling, processing, and functionalization, supported by comprehensive reliability testing methods. The approach ensures optimized performance and durability of glass-based substrates in demanding applications such as photonics and advanced packaging.

Offer Details

Specifications and Deliverables:

• Testing setups for bending strength and fatigue behavior of thin glass
• Protocols for stepwise fatigue testing of ultra-thin glass
• Statistical strength analysis and evaluation methodologies
• Assessment of coating, annealing, and separation effects on material strength
• Testing reports and validation data
• Process guidelines for reliability optimization
• Sample glass substrates for evaluation

Value Proposition:

• Comprehensive reliability testing for thin and ultra-thin glass substrates
• Advanced evaluation methods including bending strength and fatigue testing
• Statistical analysis of glass strength לאורך the entire process chain
• Assessment of surface, edge quality, and processing effects (coating, annealing, separation)
• Optimization of glass strength and reliability for industrial applications

Input Required from Customer:

• Type and specifications of glass substrate (thickness, size, composition)
• Target application (e.g., advanced packaging, photonics)
• Required reliability metrics and testing standards
• Processing conditions (coating, annealing, separation steps)
• Design constraints and performance expectations
• Quantity and stage (prototype, pilot, or production)

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Adress:

Winterbergstraße 28
Dresden
Saxony
01277
Germany

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