D 110 EI is a 100% solid, UV-curable dielectric composition designed for the insulation and protection of flexible and rigid printed electronic circuits. After polymerization, the material provides high dielectric strength, excellent intercoat adhesion, and superior flexibility, making it ideal for multi-layer printed device architectures.
The paste is formulated for screen printing and exhibits excellent adhesion even to difficult substrates such as untreated polyester and polycarbonate. Its mechanical robustness enables resistance to downstream processing steps including cutting and puncturing, making it suitable for membrane switch tail coatings, circuit crossovers, and encapsulation.
The formulation is benzophenone-free and fully compatible with common conductive silver inks in printed electronics workflows.
