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Sustainable Epitaxy for III-V Semiconductors: GaN/AlN Magnetron Sputter Epitaxy for Power Electronics and Ultra-Wide Bandgap Applications

Type of Listing:
Innovation Offers
Published: 31 March 2026
Expire Date: 09/27/2026

Thermal Management for High-Power Electronics by Thin Film Packaging: Thermally Conductive Insulation Layers and Thick Metal Heat-Spreader Layers

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026

Adhesion and Stress-Controlled Thin Films for Microelectronics: Versatile Materials Tailored to Customer Needs

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026

Novel Materials for Microelectronic Applications

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026

Energy Harvesting with Piezoelectric Materials

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026

Electrically Insulating Coatings – For Applications in Electronics, Sensor and Medical Technology

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026

Deposition of Active and Passive Films for Photonic Integrated Platforms (PIC) and Panel-Level Packaging

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026

Ferroelectric, Memristive, Phase Change and Piezoelectric Switchable Thin Films for Sensors, Actuators and Neuromorphic Computing

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026

Ultra-fast Flash Lamp Annealing for Refinement of Surfaces and Thin-Films

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026

Thin Glass Reliability Assessment for Panel-Level Applications

Type of Listing:
Innovation Offers
Published: 27 March 2026
Expire Date: 09/23/2026