Emerging substrate Ultra-thin flexible glass with thicknesses equal to or lower than 100 μm opens up opportunities for new applications,

Glass provides a promising basis for technological innovations in microelectronics. It can serve as a core and interposer substrate for

This technology provides high-quality AlN and AlScN piezoelectric thin films deposited via reactive magnetron sputtering. The films are optimized for

This technology provides high-quality AlN and AlScN piezoelectric thin films produced via magnetron sputtering, with optimized scandium content to maximize

This technology provides the deposition of highly insulating thin films using reactive magnetron sputtering. The coatings offer excellent electrical insulation

This technology focuses on energy harvesting solutions using high-quality AlN and AlScN piezoelectric thin films deposited via magnetron sputtering. The

This technology enables the growth of high-quality GaN and AlN epitaxial layers using magnetron sputter epitaxy on silicon and sapphire

This technology focuses on the development and integration of advanced functional materials for next-generation microelectronic and photonic systems. It includes

This technology provides deposition of both passive and active thin films for photonic integrated platforms and panel-level packaging. Passive materials

This technology provides advanced thin-film solutions for thermal management in high-power electronics. It includes thermally conductive insulation layers and thick

This technology focuses on the development of advanced switchable thin films, including ferroelectric, memristive, phase change, and piezoelectric materials. Using

This technology provides advanced capabilities for tailoring adhesion and residual stress in thin films across a wide range of materials