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Sheet-2-Sheet printed electronics line

Machine name:

Printed electronics pilot line

Machine type:

Sheet-2-Sheet

Substrate types to be processed:

Polymer films

Substrate dimension:

150 x 150 mm

Technologies available:

ALD encapsulation, Inkjet printing, slot die coating, vacuum evaporation, encapsulation of organic electronic (OE) devices

Deposition materials available:

Different precursors for the deposition of barrier layers by ALD, charge carrier materials and active materials for solution processing of OE devices (OLEDs, OPV, perovskite solar cells), metals such as Ag, Al, Ca, Ba for thermal evaporated electrodes

Typical applications:

Printed electronics

Deliverables

Specifications and Deliverables
Substrate types to be processed: Polymer films
Substrate dimension: 150 x 150 mm

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