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Hybridization Technology

Electrolomas can develop specific hybridization technology, validating materials to be used for electromechanical soldering at low temperature, and a process to Pick & Place SMD components at large scale on flexible foils. We can deliver hybridized foils to be thermoformed and overmoulded.

 

We offer experience testing hybridization of different kind of foils, applying the better passing materials for soldering, and getting the right temperature level. ISO 9001 and 13485

Substratum:

  • Flexible: Polyimide (up to 250⁰) and PET (up to 160-180⁰)
  • Rigid: FR4 multilayer
  • Conductive silver inks
  • Circuit measurements: from 48x48mm to 774x710mm
  • Components measurements: from 0402mm (01005”) to 74x74mm. Including BGA, WIFI and Bluetooth modules and fine pitch.
  • Machine Speed: 35.000 components/hour

Deliverables

Specifications and Deliverables
Field of application:
– Transport/Automotive
– Sports
– Security
– Packaging/Logistics
– Ligthing
– Health
– Energy
– Consumer electronics

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Xavier de Lomas Amargant

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