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Plasma Enhanced Atomic Layer Deposition (PEALD)
- Process development & contract coating: Metal oxides & nitrides, (poly)crystalline/amorph, conductive/nonconductive, including: Al2O3, SiO2, TiO2, TiN and stacks thereof
- Tool manufacturer:
semi or full automated PEALD & ALE batch tool
also applicable for PEALD-ALE in-situ processing (in one chamber!)
for 150mm (4 at once), 200mm (2 at once), 300mm, 430mm wafer substrates - FALP ® (Fast Atomic Layer Processing): optimized self developed technology for fast gas switching (down to 10ms) and cycle times of only a few secondes (usually under 3.5s) combined with a 10ms resoluting realtime process monitoring
- Consulting:
Consulting for your plasma processes
Process analysis and optimization (OES, IR absorption, chamber design) - Technology development:
Tailor made components for your ALD, ALE and plasma applications
Deliverables
Specifications and Deliverables
Consulting
Project Management
Process and Technology Development
Complete PEALD & ALE Tool
Project Management
Process and Technology Development
Complete PEALD & ALE Tool
Value Proposition
Time safing & higher productivity (fast processes with FALP-technology and no switching between chambers for ALD/ALE combined processes)
Safe one Chamber by means of ALD-ALE in-situ processing
Safe one Chamber by means of ALD-ALE in-situ processing
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